屯特大学

PhD position in multi-material additive manufacturing for advanced chip cooling

项目介绍

Are you passionate about advanced manufacturing, materials science, and semiconductor cooling technologies? We are looking for an ambitious PhD candidate to work on a cutting-edge project focused on multi-material additive manufacturing and thermal management for next-generation chip packaging. You will develop novel metal–silicon interfaces and integrated cooling solutions using Laser Powder Bed Fusion (LPBF), contributing to future high-performance computing and AI hardware.

We offer a fully funded 4-year PhD position within the University of Twente on the development of ultra-efficient cooling technologies for advanced semiconductor packaging. The project, UltraCool, combines materials science, additive manufacturing, thermal engineering, and semiconductor integration to enable direct bonding between silicon and high-conductivity metals such as copper.

The rapid growth of AI and high-performance computing is driving heat fluxes in advanced chip packages beyond 1,000 W/cm², making thermal management one of the key bottlenecks for future electronics. This PhD project aims to address this challenge through the design of novel interlayer alloys, development of multi-material Laser Powder Bed Fusion (LPBF) processes, and integration of cooling functionality directly into package-level demonstrators.

The research will focus on the thermodynamic design of interlayer alloy feedstocks, powder production and characterization, multi-material LPBF process optimization, and the investigation of interfacial physics governing residual stress, defect formation, and thermal transport across copper–silicon interfaces. You will work with characterization methods including SEM, EBSD, XRD, thermal conductivity analysis, and thermo-mechanical testing. The project also includes the fabrication and validation of package-level cooling demonstrators for direct and indirect chip cooling applications.

You will work in a highly interdisciplinary and international environment together with academic researchers and industrial partners active in semiconductor packaging, powder production, sensing technologies, and thermal management. The project offers excellent opportunities to contribute to high-impact scientific research while developing technologies with strong industrial relevance.

Your profile

We are looking for a highly motivated, enthusiastic, and self-driven researcher who meets the following qualifications:

  • A Master’s degree in Mechanical Engineering or Materials Science and Engineering or another relevant engineering/science discipline.
  • Strong interest in additive manufacturing, materials development, thermal management, and semiconductor packaging.
  • Experience with materials characterization techniques such as SEM, EBSD, XRD, thermal characterization methods, and mechanical testing is highly desirable.
  • Familiarity with additive manufacturing processes, particularly Laser Powder Bed Fusion, is an advantage.
  • Knowledge of metallurgy or computational materials engineering is beneficial.
  • Ability to work independently and collaboratively within an interdisciplinary research environment.
  • Strong analytical, experimental, and problem-solving skills.
  • Motivation to contribute to both fundamental research and industrially relevant technology development.
  • Excellent communication skills and proficiency in English, both spoken and written.

Our offer

  • A fully funded 4-year PhD position in an ambitious and internationally recognized research environment.
  • Excellent working conditions, an exciting scientific environment, and a green and lively campus with lots of sports facilities and an international scientific community. The terms of employment are in accordance with the Dutch Collective Labour Agreement for Universities (CAO)
  • Gross monthly salary of € 3.059,- in the first year, which increases to € 3.881,- in the fourth year
  • Excellent benefits include a holiday allowance of 8% of the gross annual salary, a year-end bonus of 8.3%, and a solid pension scheme.
  • You can make use of excellent facilities for professional and personal development and a training program in which you and your supervisor will make up a plan for additional suitable education and supervision.
  • You will receive good secondary conditions, in accordance with the collective labor agreement CAO-NU for Dutch universities.
  • We encourage a high degree of responsibility and independence while collaborating with close colleagues, researchers, and other university staff.

Information and application

Are you interested in being part of our team? Please send your application by July 5, 2026, via the “Apply Now” button and include the following documents:

  • A cover letter (maximum one A4 page), emphasizing your motivation, relevant expertise, and interest in the project.
  • A detailed CV including academic achievements, research experience, publications (if applicable), and contact information of at least three references.
  • Academic transcripts from your Bachelor’s and Master’s studies.

For more information about this position, you are welcome to contact Dr. Davoud Jafari at davoud.jafari@utwente.nl.

The first (online) job interviews will take place on July 10.

项目概览

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访问项目链接 招生网站
欧洲, 荷兰 所在地点
带薪岗位制 项目类别
截止日期 2026-07-05
屯特大学

院校简介

屯特大学是荷兰著名大学,也是欧洲创新型大学联盟成员之一。
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联系方式

电话: (+31) 53 489 9111

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