项目介绍

2024年10月28日

Joint imec- KU Leuven PhD position. The student will be enrolled in the Department of Mechanical Engineering, KU Leuven and will be conducting research at imec in collaboration with the Department of Mechanical Engineering.

Website van de eenheid

Project

Background:The reliability of solder joints in automotive electronics is critical due to the harsh operating environments that these components endure. Solder balls, which form the interconnections in Ball Grid Array (BGA) packages, are particularly susceptible to various aging mechanisms. These include thermal cycling, vibrations and electromigration and thermomigration, all of which can significantly impact the performance and lifespan of automotive chips.Recent advancements in numerical simulation techniques have enabled more precise modelling of these complex interactions. By leveraging these technologies, we can gain deeper insights into the failure mechanisms of solder joints and develop strategies to mitigate them.The existing models on solder integrity and reliability are either fully dedicated to thermal-mechanical stresses or fully dedicated to electromigration effects which result in voiding and microstructural changes of solder balls. Nevertheless, in realistic scenarios the two aging mechanisms act concurrently and degrade the integrity of solder balls synergistically.Problem Statement:Automotive electronics are subjected to extreme conditions that can lead to the premature failure of solder joints. The combined effects of thermal-mechanical stresses with electromigration and thermomigration, are not fully understood. This lack of understanding hampers the development of more reliable and durable electronic components.Objectives:The primary objectives of this research are:•To develop numerical physics-based modelling frameworks that can capture electromigration and thermomigration induced aging in solder balls. To this end imec has a solid track record in physics-based electromigration modelling of interconnects which will be leveraged toward solder reliability.•To couple the electromigration model with existing thermal-mechanical modeling frameworks•To experimentally calibrate and validate the models•To leverage the validated models towards reliability predictions for different package design parameters and operating conditions

Profile

Type of work: 10% literature and technological study, 70% to develop efficient computational models for predicting the mechanical reliability of RDLs and their design optimization, 20% to design and conduct experiments to calibrate and validate the computational models.

Offer

refer to imec PhD program page for details: https://www.imec-int.com/en/work-at-imec/job-opportunities/phd-at-imec

Interested?

For more information please contact Prof. dr. ir. Houman Zahedmanesh, tel.: +32 16 19 34 75, mail: houman.zahedmanesh@kuleuven.be.You can apply for this job no later than April 15, 2025 via the online application tool

KU Leuven strives for an inclusive, respectful and socially safe environment. We embrace diversity among individuals and groups as an asset. Open dialogue and differences in perspective are essential for an ambitious research and educational environment. In our commitment to equal opportunity, we recognize the consequences of historical inequalities. We do not accept any form of discrimination based on, but not limited to, gender identity and expression, sexual orientation, age, ethnic or national background, skin colour, religious and philosophical diversity, neurodivergence, employment disability, health, or socioeconomic status. For questions about accessibility or support offered, we are happy to assist you at this email address.

• Sollicitatieprocedure
• Arbeidsvoorwaarden
• Loopbaanmogelijkheden

Heb je een vraag over de online sollicitatieprocedure? Raadpleeg onze veelgestelde vragen of stuur een e-mail naar solliciteren@kuleuven.be